14

Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO2

Année:
2004
Langue:
english
Fichier:
PDF, 267 KB
english, 2004
19

Characterization of oxidized Ni3Al(1 1 0) and interaction of the oxide film with water vapor

Année:
2002
Langue:
english
Fichier:
PDF, 212 KB
english, 2002
20

Effect of surface impurities on the Cu/Ta interface

Année:
2000
Langue:
english
Fichier:
PDF, 273 KB
english, 2000
21

Copper interaction with a Ta silicate surface: implications for interconnect technology

Année:
2002
Langue:
english
Fichier:
PDF, 204 KB
english, 2002
22

Copper metallization of hydroxyl-modified amorphous Si:C:H films

Année:
2003
Langue:
english
Fichier:
PDF, 219 KB
english, 2003
23

Electrodeposition of adherent copper film on unmodified tungsten

Année:
2003
Langue:
english
Fichier:
PDF, 771 KB
english, 2003
24

Cu wetting and interfacial stability on clean and nitrided tungsten surfaces

Année:
2001
Langue:
english
Fichier:
PDF, 262 KB
english, 2001
25

Tetrakis(diethylamido) titanium (TDEAT) interactions with SiO2 and Cu substrates

Année:
2003
Langue:
english
Fichier:
PDF, 394 KB
english, 2003
27

Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition

Année:
2006
Langue:
english
Fichier:
PDF, 569 KB
english, 2006
33

H2S adsorption and the effect of sulfur on the oxidation of Ni3Al(111)

Année:
2000
Langue:
english
Fichier:
PDF, 310 KB
english, 2000
34

STM-induced void formation at the Al2O3/Ni3Al(1 1 1) interface

Année:
2001
Langue:
english
Fichier:
PDF, 332 KB
english, 2001
36

STM atomic-scale characterization of the γ′-Al2O3 film on Ni3Al(111)

Année:
1999
Langue:
english
Fichier:
PDF, 805 KB
english, 1999
48

Ta metallization of Si–O–C substrate and Cu metallization of Ta/Si–O–C multilayer

Année:
2003
Langue:
english
Fichier:
PDF, 551 KB
english, 2003